Laser Processing of Glass and Brittle Materials
Laser Processing of Glass/Materials
Laser Processing and Automation for the Micro and Macro Segment
Corning Laser Technologies offers innovative laser glass cutting and drilling technologies with distinct advantages over conventional processes. Our laser glass processing systems provide the ability to cut and drill 2D and 3D-shaped glass, such as Corning® Gorilla® Glass, Lotus™ NXT, and Eagle XG® glass, plus other chemically strengthened and non-strengthened glass types including soda-lime and other brittle materials. A newly developed glass wafer dicing solution supplements our portfolio.
Our machine platforms serve a wide range of emerging applications that require precise and flexible glass processing technologies. They are designed for 24/7 operation in an industrial environment. Designed for substrate sizes from 10mm x 10mm up to 2.5m edge length and glass thicknesses up to 10mm, Corning Laser Technologies enables flexible adaption to individual customer design requirements.
We also provide in-house process development, tailored solutions for full automation, Job-Shop offerings and much more. By leveraging more than 25 years of experience in precision laser machining, along with Corning's 170 years of material science expertise, Corning Laser Technologies is a one-stop-shop for laser processing requirements.
Laser Processing Systems & Dynatex Tools by Corning Laser Technologies (CLT)
CLT 500X
CLT 500X
The CLT 500X is a laser processing workstation designed for high-precision applications in the glass, precision engineering, and electronics industries.
The CLT 500X is a laser processing workstation designed for high-precision applications in the glass, precision engineering, and electronics industries.
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CLT 45G NX
CLT 45G NX
The CLT 45G NX laser system is specifically designed for cutting and drilling strengthened and nonstrengthened glass and other crystalline materials, as well as processing micro materials.
The CLT 45G NX laser system is specifically designed for cutting and drilling strengthened and nonstrengthened glass and other crystalline materials, as well as processing micro materials.
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CLT 66G
CLT 66G
The CLT 66G is designed for cutting and drilling strengthened glass and other brittle materials. The CLT 66G platform is a dedicated production machine for up to GEN 6 size.
The CLT 66G is designed for cutting and drilling strengthened glass and other brittle materials. The CLT 66G platform is a dedicated production machine for up to GEN 6 size.
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CLT 80G
CLT 80G
The CLT 80G laser glass processing tool is designed for 24/7 manufacturing in an industrial environment, supporting a glass substrate size of up to 2300 mm x 2500 mm.
The CLT 80G laser glass processing tool is designed for 24/7 manufacturing in an industrial environment, supporting a glass substrate size of up to 2300 mm x 2500 mm.
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CLT 3D Laser Cutting Tools
CLT 3D Laser Cutting Tools
The CLT 43D laser system as well as the new CLT 63D are designed to cut your 3D-shaped glass product. Both tools feature a specially developed, fast and highly precise CLT 5-axis beam delivery system.
The CLT 43D laser system as well as the new CLT 63D are designed to cut your 3D-shaped glass product. Both tools feature a specially developed, fast and highly precise CLT 5-axis beam delivery system.
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CLT 400S-WD
CLT 400S-WD - Corning Glass Wafer Dicing
The CLT 400S-WD is a Glass Wafer Dicing Tool that provides new solutions for glass wafer-based semiconductor applications.
The CLT 400S-WD is a Glass Wafer Dicing Tool that provides new solutions for glass wafer-based semiconductor applications.
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Dynatex DTX-200 by CLT - Scribe & Break Tool
Dynatex DTX-200 by Corning Laser Technologies (CLT) - Scribe & Break Tool
Dynatex DTX-200 by Corning Laser Technologies (CLT) - Scribe & Break Tool
Dynatex DTX-200 by Corning Laser Technologies (CLT) - Scribe & Break Tool
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Dynatex DXE Wafer Expander by CLT
Dynatex DXE Wafer Expander by Corning Laser Technologies (CLT)
Dynatex DXE Wafer Expander by Corning Laser Technologies (CLT)
Dynatex DXE Wafer Expander by Corning Laser Technologies (CLT)
Learn MoreOur Capabilities
Our Videos
CLT 63D - Your Solution for Full 3D Laser Glass Cutting
CLT 63D - Full 3D Laser Glass Cutting
Watch NowCorning Laser Technologies has scaled its 3D laser cutting technology to introduce the CLT 63D, building on the successful establishment of the CLT 43D. Its patented nanoPerforation process perforates and separates 3D-shaped substrates of up to 1,900 mm x 1,300 mm x 400 mm and thus meets an in¬creasing demand for 3D cutting of larger substrates such as automotive exterior glazing.
Welcome to the Third Dimension
Welcome to the Third Dimension
Watch NowThe enhancement of Corning Laser Technologies’ nanoPerforation process enables laser cutting of 3D-shaped glass, providing a solution for future design requirements for mobile consumer electronic devices, automotive interiors, and more.
The enhancement of Corning Laser Technologies’ nanoPerforation process enables laser cutting of 3D-shaped glass, providing a solution for future design requirements for mobile consumer electronic devices, automotive interiors, and more.
New Glass-Wafer Dicing Solution by Corning Laser Technologies (CLT)
New Glass-Wafer Dicing Solution
Watch NowCorning Laser Technologies advanced its patented nanoPerforation process and paired it with a well-established breaking technology from Dynatex International. This glass wafer dicing technology achieves superior results on yield, enabling unprecedented die aspect ratios and a side-wall quality that meets the highest demands of the semiconductor industry.
CLT 66G Large Platform Laser Cutting
CLT 66G Large Platform Laser Cutting
Watch NowThe CLT 66G provides a fully automated high throughput laser cutting solution. It uses Enhanced nanoPerforation technology, which is the latest breakthrough in laser cutting technology from Corning Laser Technologies. This patented technology enables unprecedented edge strength and process stabililty compared to other laser cutting methods.
The CLT66G provides a fully automated high throughput laser cutting solution. It uses Enhanced nanoPerforation technology, which is the latest breakthrough in laser cutting technology from Corning Laser Technologies. This patented technology enables unprecedented edge strength and process stabililty compared to other laser cutting methods.
Novel Glass Wafer Dicing
Novel Glass Wafer Dicing
Watch NowCorning Laser Technologies has developed a new glass wafer dicing method, based on the patented nanoPerforation technology. By uniting this innovative process with a well-established breaking technology, Corning Laser Technologies presents an industry-leading glass wafer dicing solution.
Corning Laser Technologies has developed a new glass wafer dicing method, based on the patented nanoPerforation technology. By uniting this innovative process with a well-established breaking technology, Corning Laser Technologies presents an industry-leading glass wafer dicing solution.
In the News
In the News
Combining High-Tech Glass Innovations with Advanced Laser Technologies
Innolux Adopts Corning Laser Technologies’ Latest Innovation for the Auto Panel Industry
Advances in Corning Laser Technologies’ NanoPerforation Improve 3D Glass Processing
Corning Offers New Multipurpose High-Precision Laser Processing Tool
Where to Find Us
Events
SPIE Photonics West, San Francisco/USA, January 27th to February 1st, 2023
SPIE Photonics West San Francisco/USA Conference: 1 February 2024 • 3:10 PM - 3:30 PM PST