Corning provides high precision glass carriers for temporary bonding used in wafer thinning, fan-out packaging, and advanced 2.5/3D packaging. Our ultra-flat glass carriers have superior surface quality, thickness, and edge strength, making them the substrate of choice for advanced packaging.
Glass has a remarkably consistent CTE, which results in much less in-process warpage due to CTE mismatch. As a transparent material, glass can support the laser bonding/debonding process to avoid chip breakage due to less debonding force. Glass can also be manufactured into ideal panel sizes such as 515 x 510 mm or 600 x 600 mm to support panel-level packaging process.
The unique glass composition of Corning’s semiconductor glass wafers manufactured using alkaline earth boro-aluminosilicate materials, along with Corning’s proprietary fusion process, offers an exceptionally low total thickness variation, a pristine surface, and outstanding mechanical strength.
