Corning provides high precision glass carriers for temporary bonding in advanced semiconductor packaging processes such as silicon wafer thinning and fan-out level processing. Our ultra-flat glass carriers have superior surface quality, thickness, and edge strength, making them the substrate of choice for advanced packaging.
Corning's glass carriers are available in a wide range of CTEs to meet customers’ most challenging requirements – from research & development phase to mass production. We have an established global supply chain and have shipped hundreds of thousands of wafers to top-tier customers already.
Learn more about Corning Carrier Solutions below, including our two product categories: Standard Glass carriers and Advanced Packaging Carriers.
