Our Capabilities
Our Capabilities
Your Application
Corning Laser Technologies (CLT) is at the forefront of laser innovation, offering laser processing systems that have a distinct advantage over conventional glass cutting processes. CLT offers laser glass processing systems with the ability to cut Corning Gorilla Glass, chemically strengthened glass as well as -strengthened glass and other brittle materials.
The flexible machine platforms are serving a wide range of emerging applications, which require precise and flexible glass processing technologies. Freedom to work substrate sizes up to an edge length of 2.5m, combined with the best available technology for beam delivery from fix optics via scanner systems to flying optics, enabling a flexible adaption to individual customer requirements.
In-house process development and tailored solutions for full automation, round off the product portfolio, providing a one-stop-shopping at Corning.
Corning’s laser processing systems are designed for continuous operation and combine +20 years of experience in laser precision machining with Corning’s unique material science knowledge.
Corning offers well-equipped laboratories in Germany, US and Asia, comprising of production like equipment, set up with a wide range of laser sources at different wavelengths and sophisticated state of the art optical, electrical and mechanical metrology tools.
Experienced applications engineers are developing individual laser process solutions in close collaboration with YOU.
Applications:
Cutting of Glass Substrates:
- Display glass
- Coated substrates
- Sandwich applications
- Cutting thin substrates
Separation of Strengthened Glass
- Cover glass for mobile phones
- Cover glass for tablets and PCs
- Camera production glass
Drilling in Glass Substrates:
- Mobile devices (camera aperture, home button, speaker etc.)
- Welding and laser marking / identification
- DMC
- OCR
Processing:
- Thin-film
- Ceramics
- Semi-conductor materials
- OLED, PET
- Metals and non-metals
Laser Processing Systems
CLT 500X
CLT 500X
The CLT 500X is a laser processing workstation designed for high-precision applications in the glass, precision engineering, and electronics industries.
The CLT 500X is a laser processing workstation designed for high-precision applications in the glass, precision engineering, and electronics industries.
Learn MoreCLT 45G NX
CLT 45G NX
The CLT 45G NX laser system is specifically designed for cutting and drilling strengthened and nonstrengthened glass and other crystalline materials, as well as processing micro materials.
The CLT 45G NX laser system is specifically designed for cutting and drilling strengthened and nonstrengthened glass and other crystalline materials, as well as processing micro materials.
Learn MoreCLT 66G
CLT 66G
The CLT 66G is designed for cutting and drilling strengthened glass and other brittle materials. The CLT 66G platform is a dedicated production machine for up to GEN 6 size.
The CLT 66G is designed for cutting and drilling strengthened glass and other brittle materials. The CLT 66G platform is a dedicated production machine for up to GEN 6 size.
Learn MoreCLT 80G
CLT 80G
The CLT 80G laser glass processing tool is designed for 24/7 manufacturing in an industrial environment, supporting a glass substrate size of up to 2300 mm x 2500 mm.
The CLT 80G laser glass processing tool is designed for 24/7 manufacturing in an industrial environment, supporting a glass substrate size of up to 2300 mm x 2500 mm.
Learn MoreCLT 3D
CLT 3D Laser Cutting Tools
The CLT 43D laser system as well as the new CLT 63D are designed to cut your 3D-shaped glass product. Both tools feature a specially developed, fast and highly precise CLT 5-axis beam delivery system.
The CLT 43D laser system as well as the new CLT 63D are designed to cut your 3D-shaped glass product. Both tools feature a specially developed, fast and highly precise CLT 5-axis beam delivery system.
Learn MoreCLT 400S-WD
CLT 400S-WD
The CLT 400S-WD is a Glass Wafer Dicing Tool that provides new solutions for glass wafer-based semiconductor applications by combining our proprietary laser cutting process with the well-established Street-Smart Breaking Technology.
The CLT 400S-WD is a Glass Wafer Dicing Tool that provides new solutions for glass wafer-based semiconductor applications by combining our proprietary laser cutting process with the well-established Street-Smart Breaking Technology.
Learn More