Our Capabilities
Our Capabilities
Laser Cutting Display and Strengthened Glass and Glass Substrates
Corning Laser Technologies' laser cutting processes employ ultra-short laser pulses in the picosecond range that cut glass, utilizing nonlinear processes. This ensures a low as cut edge roughness, increased cut bend strength, and a higher throughput. Corning’s laser glass cutting thus enables superb as cut quality, maximum output and yield in high volume production of touchscreen displays for smart phones, tablet PCs and other consumer products.
With an as cut edge roughness at < 2µm, in most cases the cut glass can be used for subsequent processing without additional intermediate steps for time and cost consuming post-processing. Glass pieces cut with Corning Laser Technologies' unique laser glass cutting process have superior break strength behavior, compared to items cut by other laser methods and conventional mechanical glass cutting processes.
Laser Processing Systems
CLT 500X
CLT 500X
The CLT 500X is a laser processing workstation designed for high-precision applications in the glass, precision engineering, and electronics industries.
The CLT 500X is a laser processing workstation designed for high-precision applications in the glass, precision engineering, and electronics industries.
Learn MoreCLT 45G NX
CLT 45G NX
The CLT 45G NX laser system is specifically designed for cutting and drilling strengthened and nonstrengthened glass and other crystalline materials, as well as processing micro materials.
The CLT 45G NX laser system is specifically designed for cutting and drilling strengthened and nonstrengthened glass and other crystalline materials, as well as processing micro materials.
Learn MoreCLT 66G
CLT 66G
The CLT 66G is designed for cutting and drilling strengthened glass and other brittle materials. The CLT 66G platform is a dedicated production machine for up to GEN 6 size.
The CLT 66G is designed for cutting and drilling strengthened glass and other brittle materials. The CLT 66G platform is a dedicated production machine for up to GEN 6 size.
Learn MoreCLT 80G
CLT 80G
The CLT 80G laser glass processing tool is designed for 24/7 manufacturing in an industrial environment, supporting a glass substrate size of up to 2300 mm x 2500 mm.
The CLT 80G laser glass processing tool is designed for 24/7 manufacturing in an industrial environment, supporting a glass substrate size of up to 2300 mm x 2500 mm.
Learn MoreCLT 3D
CLT 3D
The CLT 43D laser system as well as the new CLT 63D are designed to cut your 3D-shaped glass product. Both tools feature a specially developed, fast and highly precise CLT 5-axis beam delivery system.
The CLT 43D laser system as well as the new CLT 63D are designed to cut your 3D-shaped glass product. Both tools feature a specially developed, fast and highly precise CLT 5-axis beam delivery system.
Learn MoreCLT 400S-WD
CLT 400S-WD
The CLT 400S-WD is a Glass Wafer Dicing Tool that provides new solutions for glass wafer-based semiconductor applications by combining our proprietary laser cutting process with the well-established Street-Smart Breaking Technology.
The CLT 400S-WD is a Glass Wafer Dicing Tool that provides new solutions for glass wafer-based semiconductor applications by combining our proprietary laser cutting process with the well-established Street-Smart Breaking Technology.
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