Corning offers advanced laser machining systems for glass processing of both strengthened and unstrengthened glass as well as other brittle materials. Our application lab located in Germany can work with you to produce a solution tailored to your requirements.
- Cutting of Glass Substrates
- Display glass
- Coated substrates
- Sandwich applications
- Cutting thin substrates
- Separation of Strengthened Glass
- Cover glass for mobile phones
- Cover glass for tablets and PCs
- Camera protection glass
- Drilling in Glass Substrates
- Mobile device (camera aperture, home button, speaker etc.)
