Our Capabilities
Our Capabilities
Advanced Laser Process
Conventional laser cutting is based on rapid heating processes, leading to vaporization and material removal. This method tends to create micro-cracks, chip-outs and a rough surface finish, which makes time consuming and costly subsequent grinding and polishing steps necessary, leading to low production yields. Using specialty tuned lasers to cut glass by disassociation rather than ablation, the Corning laser glass cutting technology provides numberous benefits:
Smooth Edges - The 'as-cut` edge roughness may significantly reduce or in some cases even eliminate post-processing and thus process time and cost.
High Break Strength - The 'as-cut` edge demonstrates superior break strength over other laser and conventional cutting processes as measured by 4 point bend tests.
Multi-Layer Stacks - The system enable cutting of assembled functional multi-layer stacks with and without air gaps, where cutting depths can be adjusted.
Remarkable Technology
Corning's material science and optic capabilities and unique advantages to the laser glass cutting process. It offers not only distinct advantages over conventional cutting processes, but also over other laser cutting systems. Using ultra-short laser pulses, the material is cut by material disassociation rather than ablation. The result is very low surface, increased as-cut bend strength and faster throughput. The Corning laser process enables cutting strengthened glass, un-strenghthened glass, as well as other transparent glass and crystalline materials.
Laser Procssing Systems
CLT 500X
CLT 500X
The CLT 500X is a laser processing workstation designed for high-precision applications in the glass, precision engineering, and electronics industries.
The CLT 500X is a laser processing workstation designed for high-precision applications in the glass, precision engineering, and electronics industries.
Learn MoreCLT 45G NX
CLT 45G NX
The CLT 45G NX laser system is specifically designed for cutting and drilling strengthened and nonstrengthened glass and other crystalline materials, as well as processing micro materials.
The CLT 45G NX laser system is specifically designed for cutting and drilling strengthened and nonstrengthened glass and other crystalline materials, as well as processing micro materials.
Learn MoreCLT 66G
CLT 66G
The CLT 66G is designed for cutting and drilling strengthened glass and other brittle materials. The CLT 66G platform is a dedicated production machine for up to GEN 6 size.
The CLT 66G is designed for cutting and drilling strengthened glass and other brittle materials. The CLT 66G platform is a dedicated production machine for up to GEN 6 size.
Learn MoreCLT 80G
CLT 80G
The CLT 80G laser glass processing tool is designed for 24/7 manufacturing in an industrial environment, supporting a glass substrate size of up to 2300 mm x 2500 mm.
The CLT 80G laser glass processing tool is designed for 24/7 manufacturing in an industrial environment, supporting a glass substrate size of up to 2300 mm x 2500 mm.
Learn MoreCLT 3D
CLT 3D Laser Cutting Tools
The CLT 43D laser system as well as the new CLT 63D are designed to cut your 3D-shaped glass product. Both tools feature a specially developed, fast and highly precise CLT 5-axis beam delivery system.
The CLT 43D laser system as well as the new CLT 63D are designed to cut your 3D-shaped glass product. Both tools feature a specially developed, fast and highly precise CLT 5-axis beam delivery system.
Learn MoreCLT 400S-WD
CLT 400S-WD
The CLT 400S-WD is a Glass Wafer Dicing Tool that provides new solutions for glass wafer-based semiconductor applications by combining our proprietary laser cutting process with the well-established Street-Smart Breaking Technology.
The CLT 400S-WD is a Glass Wafer Dicing Tool that provides new solutions for glass wafer-based semiconductor applications by combining our proprietary laser cutting process with the well-established Street-Smart Breaking Technology.
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