Our Capabilities
Our Capabilities
Thick Glass Cutting | Laser Glass Cutting Thick Glass Technologies | Corning
Corning Laser Technologies can accurately cut thicker glass materials or functionalized and stacked glasses at high processing speeds.
There is a trend towards new structural and design features in architectural glass and smart windows applications that are increasingly difficult to achieve with conventional glass cutting methods.
With the advancement of the laser technology in general and commercial availability of industrial ultra-fast laser sources with even higher power and pulse energy, Corning Laser Technologies is able to scale the laser cutting performance such that also thicker glass materials or functionalized and stacked glasses can be accurately cut at high processing speeds.
We have further developed the Corning® nanoPerforation technology to cut glass thicknesses of up to 10mm in a single pass, providing all the benefits of the laser cutting combined with high throughput at the same time. This thick glass capability can also be utilized for cutting of complex shapes, coated glass and structures like the smart windows. Being able to nanoPerforate the smart window glass stack in a single pass and the half-cut with minimum damage to the TCO-film of the lower sheet, enables to streamline the smart window manufacturing process with a high design flexibility at the same time.
By incorporating our enhanced thick glass capability into our machine platforms designed for and proven in 24/7 manufacturing environments, we provide a highly economical and reliable solution for laser cutting of architectural glass, smart windows and other complex structures, opening the doors to new possibilities.
Benefits:
• Glass Thicknesses up to 10 mm
• nanoPerforation through entire glass thickness in one single pass
• Thick glass cutting for architectural applications
• Precise cutting of smart window glass stacks
• Streamline manufacturing processes
• Outstanding design flexibility
• High throughput and processing speed
Laser Processing Systems
CLT 500X
CLT 500X
The CLT 500X is a laser processing workstation designed for high-precision applications in the glass, precision engineering, and electronics industries.
The CLT 500X is a laser processing workstation designed for high-precision applications in the glass, precision engineering, and electronics industries.
Learn MoreCLT 45G NX
CLT 45G NX
The CLT 45G NX laser system is specifically designed for cutting and drilling strengthened and nonstrengthened glass and other crystalline materials, as well as processing micro materials.
The CLT 45G NX laser system is specifically designed for cutting and drilling strengthened and nonstrengthened glass and other crystalline materials, as well as processing micro materials.
Learn MoreCLT 66G
CLT 66G
The CLT 66G is designed for cutting and drilling strengthened glass and other brittle materials. The CLT 66G platform is a dedicated production machine for up to GEN 6 size.
The CLT 66G is designed for cutting and drilling strengthened glass and other brittle materials. The CLT 66G platform is a dedicated production machine for up to GEN 6 size.
Learn MoreCLT 80G
CLT 80G
The CLT 80G laser glass processing tool is designed for 24/7 manufacturing in an industrial environment, supporting a glass substrate size of up to 2300 mm x 2500 mm.
The CLT 80G laser glass processing tool is designed for 24/7 manufacturing in an industrial environment, supporting a glass substrate size of up to 2300 mm x 2500 mm.
Learn MoreCLT 3D
CLT 3D
The CLT 43D laser system as well as the new CLT 63D are designed to cut your 3D-shaped glass product. Both tools feature a specially developed, fast and highly precise CLT 5-axis beam delivery system.
The CLT 43D laser system as well as the new CLT 63D are designed to cut your 3D-shaped glass product. Both tools feature a specially developed, fast and highly precise CLT 5-axis beam delivery system.
Learn MoreCLT 400S-WD
CLT-400S-WD
The CLT 400S-WD is a Glass Wafer Dicing Tool that provides new solutions for glass wafer-based semiconductor applications by combining our proprietary laser cutting process with the well-established Street-Smart Breaking Technology.
The CLT 400S-WD is a Glass Wafer Dicing Tool that provides new solutions for glass wafer-based semiconductor applications by combining our proprietary laser cutting process with the well-established Street-Smart Breaking Technology.
Learn More