Dynatex DTX-200 by CLT

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Dynatex Tools By Corning Laser Technologies (CLT)

Dynatex Tools By Corning Laser Technologies (CLT)

Dynatex DXE 5 & 9 Series Wafer Expander by CLT

Configurations for various hoop sizes are available upon request. Our DXE wafer expanders are design for expanding wafers after the singulation of the dies. A gap is created between the dies for pick-and-place operation, thus preventing die edge chipping contact during shipping or the pick-and-place handling. Gap size can be adjusted through multiple expansions. Custom configurations are available upon request.

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Dynatex DXE 5 Series Wafer Expander by CLT accommodates a wide variety of film frames and hoop sets up to 150 mm (6 inch) wafers. The lid is manually activated, forcing the outer hoop over the inner hoop.

Dynatex DXE 9 Series Wafer Expander by CLT is designed for film frames and hoop sets up to 200 mm (8 inch) wafer. The lid is pneumatically activated, forcing the outer hoop over the inner hoop and therefore requires compressed air.
 
Typical functions of the Dynatex DXE Wafer Expanders by CLT:
  • Designed to expand the space between singulated semiconductor die
  • Provides omni-directional stretching of the tape on which these die have been mounted
  • Heats the tape to improve the tape flexibility
  • Adjustable temperature as required
  • Transfers wafers from film frames to hoops as required
  • Multiple expansions possible to reach required die gap size

 

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