Next Generation Optical Components and Solutions

Corning and Broadcom have collaborated to develop this white paper, which delves into insights and expertise, with a specific focus on the emerging field of co-packaged optics (CPO).

This white paper will provide readers with valuable insights into CPO and the revolutionary technology that is reshaping high-bandwidth switches and distributed-computing hardware in data centers. The paper explores the design and handling practices developed over decades to ensure high reliability when using optical fibers, with a specific focus on emerging CPO designs. Readers will learn about the challenges manufacturers may face in adapting to this new infrastructure, particularly in terms of reliability and deployment. It also discusses the requirements for CPO reliability and aims to provide reasonable working targets for engineers.

Overall, this comprehensive resource equips readers with the knowledge and understanding needed to navigate the complexities of CPO and harness its potential in data center architecture.

Download the white paper now to gain a deeper understanding of the design and handling practices that will help you maintain high levels of reliability in the context of emerging CPO designs.

Download the White Paper >

The growing demand for data and the challenges faced by data centers, such as reducing power consumption and cost per bit, have increased the significance of Corning’s co-packaged optics (CPO). CPO, which involves integrating optical components into switch boxes, holds great potential in addressing these challenges. While progress has been made in developing electronic components for CPO, the successful implementation of CPO also depends on the design and development of optical system solutions. Specifically, optimizing the complete optical system requires tailored optical components and effective management of the fiber within the switch box. Corning is a key component to the innovation and adaptation of CPO and Fiber-to-the-Chip (FTTC) on-board connectivity technology. 

Managing waveguides plays a crucial role in co-packaged optics. The fiber array unit (FAU), responsible for aligning fibers to waveguides, becomes more critical in CPO applications. Achieving low coupling losses requires tight positional tolerances and well-centered cores. Higher-fiber-count FAUs, such as those with 32 or 64 fibers, are needed to accommodate the higher densities in CPO. Manufacturing FAUs for CPO should consider polarization maintaining fiber (PMF) orientation and polarization extinction ratio (PER) maintenance, while retaining the high intrinsic reliability of the fiber. Experience in manufacturing FAUs for telecom settings can be advantageous due to similarities between CPO and telecom applications.